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LED Solder paste

LED Solder paste L909

Product parameters

★L(fēng)oose reflow process window
★Excellent wetting and tin eating ability
★L(fēng)ow bubble and void ratio
★The adhesive force can be maintained for a long time
★Transparent residue

Scope of application

Suitable for SMT industry PCB surface resistance, capacitance, IC and other electronic components welding

Specification Download Online consultation

Selection of tin powder
Specifications	Maximum limit	Greater than this value less than 1%	Less than 80% between these values	Less than 90 percent	Less than 10%	Recommend suitable process
2	80μm	75μm	75-45μm	——	20μm	pitch≥0.5mm Inner diameter of needle≥0.8mm
3	50μm	45μm	45-25μm	——	20μm	pitch≥0.4mm Inner diameter of needle≥0.6mm
4	40μm	38μm	——	38-20μm	20μm	pitch≥0.4mm Inner diameter of needle≥0.5mm
5	28μm	25μm	——	25-15μm	15μm	pitch≥0.3mm Inner diameter of needle≥0.4mm

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